| P/N | CL-O023-GROSGM-A |
|---|---|
| THERMAL CONDUCTIVITY | 4.5 W/m-k |
| COLOR | Gray |
| WEIGHT | 4g |
| VISCOSITY | 76 Pa-s |
| THERMAL IMPEDANCE | 0.185°C -in²/W |
| DENSITY | 2.55 g/cm³ |
TT TG-30 Thermal Compound
12.00 $
TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.
High Thermal Conductivity
The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.
Easy to Apply
Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
Availability: in stock
